Package Design Engineer / Package Design Engineeress

Join Our Team at Kandou

Challenges are our drive, and innovation is our calling. At Kandou, we are a team of passionate professionals making a significant impact in the semiconductor industry. As a leader in high-speed and energy-efficient chip-chip link solutions, we are committed to shaping the future of electronics. If you're eager to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an exciting opportunity for you.

Responsibilities and Authority

• Execute all package design activities within the project deliverable timelines.
• Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
• Collaborate closely with IC layout engineers during the package design phase.
• Verify the electrical characteristics of the package and unit design using available software tools.
• Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs, including multi-layer, mechanical drill, and plating lines.
• Provide support, guidance, and instructions related to assembly/package activities, questions, and issues.
• Present detailed weekly reports on activities and progress to the cross-functional team.
• Work with multi-functional groups, including product design, engineering, and marketing, to ensure that package design and technology requirements are fully supported by Kandou’s assembly partners.

Required Competencies – Experience

• Minimum of 5 years of experience in IC package design using Cadence APD/SIP.
• Hands-on experience with Cadence (Virtuoso/Extract IM/Power DC), Ansys software tools (SiWave/Q3D), or similar tools.
• Experience using AutoCAD.
• In-depth knowledge of various electronic IC packaging technologies is essential.
• Basic understanding of thermal and mechanical behavior of IC packages.
• Familiarity with IC physical layout is advantageous.

Required Competencies – Skills

• Proven expertise in package design and RLC extraction.
• Ability to perform package parasitics extraction.
• Strong task management and planning skills, with proficiency in estimating project timelines.
• Able to work under tight and variable deadlines.
• Excellent interpersonal and communication skills.
• Strong networking, negotiation, and influencing abilities.
• Adept at managing communication with assembly subcontractors.

Apply Today

If this is the role you have been looking for and you want to be part of a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered. Together, We Kandou It!