Package Design Engineer / Package Design Engineeress

Join Our Team at Kandou

Challenges are our drive, innovation our calling. At Kandou, we are a team of passionate and accomplished professionals making a mark in the semiconductor industry. As an innovative leader in high-speed and energy-efficient chip-to-chip link solutions, we are critical to the evolution of the electronics industry. We continuously develop our solutions to meet the demands of today's customers and the challenges of tomorrow. If you have a passion for high-tech environments and thrive on pushing your limits while challenging the status quo, we have an exciting opportunity for you.

Responsibilities

• Complete all package design activities within the time frames defined by project deliverables.
• Conduct package design review processes with assembly subcontractors to ensure no design rule violations.
• Liaise closely with IC layout engineers during the package design phase.
• Verify the electrical characteristics of the package and unit design using available software tools.
• Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (multi-layer, mechanical drill, plating lines, etc.).
• Provide support, guidance, and instructions for assembly/package-related activities, questions, and issues.
• Present detailed weekly reports of activities and progress to the cross-functional team.
• Collaborate with multi-functional groups including product design, engineering, and marketing to ensure our package design and technology requirements are fully supported by Kandou’s assembly partners.

Required Competencies – Experience

• Minimum of 5 years of experience in IC package design using Cadence APD/SIP.
• Hands-on experience with Cadence tools (Virtuoso, Extract IM, Power DC) and Ansys software (SiWave, Q3D) or similar tools.
• Experience using AutoCAD.
• Knowledge of various electronic IC packaging technologies is essential.
• Basic understanding of thermal and mechanical behavior of IC packages.
• Basic understanding of IC physical layout is beneficial.

Required Competencies – Skills

• Proven top-level package design and RLC extraction experience.
• Ability to perform package parasitic extraction.
• Strong task management and planning ability with proficiency in estimating timescales for design completion.
• Able to work under tight and variable timelines.
• Excellent interpersonal and communication skills.
• Strong networking, negotiation, and influencing abilities.
• Adept at managing communication with assembly subcontractors.

If this role resonates with you and you want to be part of a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.