Package Design Engineer / Package Design Engineeress

Join Our Team at Kandou

Challenges fuel our drive, and innovation is our calling. At Kandou, we are a team of passionate professionals making a significant impact in the semiconductor industry. As a leading innovator in high-speed and energy-efficient chip-chip link solutions, we are dedicated to advancing the electronics sector to meet today’s demands and future needs. If you thrive in a high-tech environment and are motivated by pushing boundaries and challenging the norm, this opportunity may be for you.

Responsibilities and Authority

• Complete all package design activities within the set timeframe as defined by project deliverables.
• Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
• Collaborate closely with IC layout engineers during the package design phase.
• Verify electrical characteristics of the package and unit design using available software tools.
• Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (e.g., Multi Layer, Mechanical Drill, Plating Lines).
• Provide support, guidance, and instructions regarding assembly and package-related queries and issues.
• Present detailed weekly reports on activities and progress to the cross-functional team.
• Work with multidisciplinary groups, including product design, engineering, and marketing, to ensure package design and technology requirements are fully aligned with Kandou’s assembly partners.

Required Competencies – Experience

• Minimum of 5 years’ experience in IC Package Design using Cadence APD / SIP.
• Hands-on experience with Cadence tools (Virtuoso, Extract IM, Power DC) and Ansys software (SiWave, Q3D) or similar tools.
• Proficiency in AutoCAD.
• Knowledge of various electronic IC packaging technologies is essential.
• Basic understanding of thermal and mechanical behavior of IC packages.
• Familiarity with IC physical layout concepts is beneficial.

Required Competencies – Skills

• Demonstrated expertise in package design and RLC extraction.
• Ability to perform package parasitics extraction.
• Strong task management and planning capabilities, with proficiency in estimating timelines for design completion.
• Able to work under tight and variable timelines.
• Excellent interpersonal and communication skills.
• Strong networking, negotiation, and influencing abilities.
• Adept at managing communications with assembly subcontractors.

If this role resonates with you and you’re eager to be a part of a growing company with an exciting future, we invite you to apply online using the form below. Please note that only applications matching the job profile will be considered.

Together, we can make great things happen at Kandou!