Join Our Innovative Team at Kandou
Challenges are our drive, and innovation is our calling. At Kandou, we are a team of passionate and accomplished professionals making a mark in the semiconductor industry. As an innovative leader in high-speed and energy-efficient chip-to-chip link solutions, we are committed to meeting the evolving demands of today's customers and tomorrow's technologies. If you thrive in a high-tech scale-up environment and are driven to push your limits and challenge the status quo, we have an exciting opportunity for you.
Responsibilities
- Complete all package design activities within the specified time frame as defined by project deliverables.
- Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
- Collaborate closely with IC layout engineers throughout the package design phase.
- Verify electrical characteristics of package and unit designs using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs.
- Provide support, guidance, and instructions for assembly and package-related activities, questions, and issues.
- Present detailed weekly reports of activities and progress to the cross-functional team.
- Engage with multi-functional groups including product design, engineering, and marketing to ensure alignment with Kandou’s assembly partners.
Required Competencies – Experience
- Minimum of 5 years of experience in IC package design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso / Extract IM / Power DC) or Ansys software tools (SiWave / Q3D).
- Proficiency in AutoCAD.
- Strong knowledge of various electronic IC packaging technologies.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Familiarity with IC physical layout is beneficial.
Required Competencies – Skills
- Demonstrated top-level package design and RLC extraction experience.
- Ability to perform package parasitics extraction.
- Strong task management and planning skills, with proficiency in estimating timelines for design completion.
- Ability to work under tight and variable timelines.
- Excellent interpersonal and communication skills.
- Good networking, negotiation, and influencing abilities.
- Adept at managing communication with assembly subcontractors.
Apply Today!
If this is the role you have been looking for and you want to be part of a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
Together, We Kandou It!