Join Our Team at Kandou
Challenges drive us, and innovation is our calling. At Kandou, we are a team of passionate and accomplished professionals making a significant impact in the semiconductor industry. As an innovative leader in high-speed and energy-efficient chip-to-chip link solutions, we play a crucial role in the evolution of electronics. We continuously evolve to meet the demands of today's customers and anticipate the needs of tomorrow. If you are excited about being part of a high-tech scale-up and motivated by pushing your limits while challenging the status quo, we have an opportunity for you.
Responsibilities and Authority
- Complete all package design activities within the defined time frame as per project deliverables.
- Oversee the package design review processes with assembly subcontractors to avoid design rule violations.
- Liaise closely with IC layout engineers during the package design phase.
- Verify the electrical characteristics of the package and unit design using available software tools.
- Integrate cost-effective methodologies into Kandou’s BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines, etc.).
- Provide support, guidance, and instructions for assembly and package-related activities, questions, and issues.
- Present detailed weekly reports of activities and progress to the cross-functional team.
- Collaborate with multi-functional groups, including product design, engineering, and marketing, to ensure our package design/technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- Minimum 5 years of experience in IC package design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso / Extract IM / Power DC) and Ansys software tools (SiWave / Q3D) or similar instruments.
- Experience using AutoCAD.
- Knowledge of various electronic IC packaging technologies is essential.
- Basic understanding of thermal and mechanical behavior of IC packages is crucial.
- Basic understanding of IC physical layout is beneficial.
Required Competencies – Skills
- Proven top-level package design and RLC extraction experience.
- Ability to perform package parasitics extraction.
- Strong task management and planning skills, including proficiency in estimating timescales for design completion.
- Capability to work under tight and variable timeframes.
- Excellent interpersonal and communication skills.
- Good networking, negotiation, and influencing skills.
- Adept at managing communication with assembly subcontractors.
If you are looking for a role with an exciting future and wish to join a thriving company, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
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