Join Our Team at Kandou
At Kandou, challenges drive us and innovation calls us. We are a team of passionate and accomplished professionals making a significant impact in the semiconductor industry. As an innovative leader in high-speed and energy-efficient chip-chip link solutions, we are integral to the evolution of the electronics sector. We continuously adapt to meet the demands of today's customers and look ahead to tomorrow's challenges. If you thrive in a high-tech environment and are motivated by pushing your limits and challenging the status quo, we have an exceptional opportunity for you.
Responsibilities
- Complete all package design activities within the time frame defined by project deliverables.
- Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
- Liaise closely with IC layout engineers during the package design phase.
- Verify electrical characteristics of the package and unit design using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (Multi-Layer, Mechanical Drill, Plating Lines, etc.).
- Provide support, guidance, and instruction for assembly and package-related inquiries and issues.
- Present detailed weekly reports of activities and progress to the cross-functional team.
- Work collaboratively with multi-functional groups, including product design, engineering, and marketing, to ensure our package design and technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- A minimum of 5 years of experience in IC package design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso, Extract IM, Power DC) and Ansys software tools (SiWave, Q3D) or similar tools.
- Experience using AutoCAD.
- In-depth knowledge of various electronic IC packaging technologies is a must.
- Basic understanding of the thermal and mechanical behavior of IC packages.
- Beneficial to have a basic understanding of IC physical layout.
Required Competencies – Skills
- Proven expertise in package design and RLC extraction.
- Able to perform package parasitics extraction effectively.
- Strong task management and planning abilities, with proficiency in estimating timelines for design completion.
- Capable of working under tight and variable timescales.
- Excellent interpersonal and communication skills.
- Strong networking, negotiation, and influencing skills.
- Adept at managing communication with assembly subcontractors.
If you are excited about this role and wish to be part of our growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
Together, We Kandou It!
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