Join Our Team at Kandou
At Kandou, we are driven by challenges and inspired by innovation. As a leading player in the semiconductor industry, our team of passionate professionals is making strides in high-speed, energy-efficient chip-chip link solutions that are essential for the advancement of the electronics sector. We are continuously evolving to meet the needs of today’s customers and the demands of tomorrow. If you thrive in a high-tech scale-up environment and are motivated by pushing your limits and challenging the status quo, we invite you to explore this exciting opportunity.
Responsibilities and Authority
- Execute all package design activities within the time frame defined by the project deliverables.
- Oversee package design review processes with assembly subcontractors to ensure adherence to design rules.
- Collaborate closely with IC layout engineers during the package design phase.
- Verify the electrical characteristics of the package and unit design using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs, including multi-layer, mechanical drilling, and plating lines.
- Provide support, guidance, and instructions for assembly and package-related activities, questions, and issues.
- Present detailed weekly reports on activities and progress to the cross-functional team.
- Work with multi-functional groups, including product design, engineering, and marketing, to ensure that our package design and technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- Minimum of 5 years of experience in IC package design using Cadence APD/SIP.
- Hands-on experience with Cadence tools (Virtuoso, Extract IM, Power DC) and Ansys software (SiWave, Q3D) or similar tools.
- Experience using AutoCAD.
- In-depth knowledge of various electronic IC packaging technologies is essential.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Basic understanding of IC physical layout is advantageous.
Required Competencies – Skills
- Proven expertise in package design and RLC extraction.
- Ability to perform package parasitics extraction.
- Strong task management and planning skills, with proficiency in estimating timelines for design completion.
- Capability to work under tight and variable deadlines.
- Excellent interpersonal and communication skills.
- Effective networking, negotiation, and influencing skills.
- Adept at managing communication with assembly subcontractors.
If this role aligns with your aspirations and you want to join a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.