Join Our Team at Kandou
Challenges fuel our passion, and innovation inspires our mission. At Kandou, we pride ourselves on being a team of dedicated and skilled professionals who are making significant contributions in the semiconductor industry. As a forward-thinking leader in high-speed and energy-efficient chip-chip link solutions, we play a critical role in shaping the future of the electronics industry. Our commitment to continuous development enables us to meet the evolving demands of today’s customers, and those of tomorrow. If you're excited about being part of a high-tech scale-up and thrive on pushing your limits while challenging the status quo, we have a promising opportunity for you.
Responsibilities and Authority
- Complete all package design activities within the specified time frames as defined by project deliverables.
- Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
- Collaborate closely with IC layout engineers during the package design phase.
- Verify electrical characteristics of the package and unit design using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (Multi-Layer / Mechanical Drill / Plating Lines, etc.).
- Provide support, guidance, and instructions for assembly/package-related activities, questions, and issues.
- Present detailed weekly reports on activities and progress to the cross-functional team.
- Engage with multi-functional groups, including product design, engineering, and marketing, to ensure our package design/technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- Minimum of 5 years of experience in IC Package Design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso / Extract IM / Power DC) / Ansys software tools (SiWave / Q3D) or similar tools.
- Experience with AutoCAD.
- Knowledge of various electronic IC packaging technologies is essential.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Familiarity with IC physical layout is advantageous.
Required Competencies – Skills
- Proven expertise in package design and RLC extraction.
- Ability to perform package parasitics extraction.
- Strong task management and planning skills, with proficiency in estimating timelines for design completion.
- Able to work under tight and variable deadlines.
- Excellent interpersonal and communication skills.
- Good networking, negotiation, and influencing abilities.
- Adept at managing communication with assembly subcontractors.
If this role aligns with your career aspirations and you are eager to be part of a dynamic company with a bright future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
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