Join Our Innovative Team at Kandou
Challenges drive us, and innovation is our calling. At Kandou, we are a team of passionate and accomplished professionals making a mark in the semiconductor industry. As a leading innovator in high-speed and energy-efficient chip-to-chip link solutions, we are dedicated to meeting the demands of today’s customers and shaping the future of the electronics industry.
If you are eager to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an exciting opportunity for you.
Responsibilities and Authorities
- Complete all package design activities within the designated time frame as defined by project deliverables.
- Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
- Liaise closely with IC layout engineers during the package design phase.
- Verify electrical characteristics of the package and unit design using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (multi-layer, mechanical drill, plating lines, etc.).
- Provide support, guidance, and instructions regarding assembly/package-related activities, questions, and issues.
- Present detailed weekly reports of activities and progress to the cross-functional team.
- Collaborate with multi-functional groups including product design, engineering, and marketing to ensure that our package design and technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- Minimum of 5 years of experience in IC package design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso / Extract IM / Power DC) / Ansys software tools (SiWave / Q3D) or similar tools.
- Experience using AutoCAD.
- Knowledge of various electronic IC packaging technologies is essential.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Basic understanding of IC physical layout is advantageous.
Required Competencies – Skills
- Proven package design and RLC extraction experience at a top level.
- Ability to perform package parasitics extraction.
- Strong task management and planning abilities.
- Proficiency in estimating timelines for design completion.
- Able to work within tight and variable time scales.
- Strong interpersonal and communication skills.
- Excellent networking, negotiation, and influencing skills.
- Adept at managing communication with assembly subcontractors.
If this is the role you have been looking for and you want to be part of a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
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