Join Our Team at Kandou
At Kandou, we are driven by challenges and inspired by innovation. Our team consists of passionate professionals making significant strides in the semiconductor industry. As a leader in high-speed and energy-efficient chip-chip link solutions, we are committed to advancing the electronics sector to meet the demands of today's customers and those of tomorrow. If you thrive in a high-tech environment and are motivated to push your limits while challenging the status quo, we invite you to explore this exciting opportunity.
Responsibilities
As a key member of our team, your responsibilities will include:
- Completing all package design activities within the time frame defined by project deliverables.
- Conducting package design review processes with assembly subcontractors to ensure compliance with design rules.
- Liaising closely with IC layout engineers throughout the package design phase.
- Verifying the electrical characteristics of the package and unit design using available software tools.
- Incorporating cost-effective methodologies into Kandou’s BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines, etc.).
- Providing support, guidance, and instruction for assembly and package-related activities, questions, and issues.
- Presenting detailed weekly reports of activities and progress to the cross-functional team.
- Collaborating with multi-functional groups, including product design, engineering, and marketing, to ensure our package design and technology requirements are effectively supported by Kandou’s assembly partners.
Required Competencies – Experience
- Minimum of 5 years experience in IC Package Design using Cadence APD / SIP.
- Hands-on experience with Cadence (Virtuoso / Extract IM / Power DC) / Ansys software tools (SiWave / Q3D) or similar.
- Experience using AutoCAD.
- Knowledge of various electronic IC packaging technologies is essential.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Basic knowledge of IC physical layout is beneficial.
Required Competencies – Skills
- Proven expertise in package design and RLC extraction.
- Ability to perform package parasitic extraction.
- Strong task management and planning abilities with proficiency in estimating project timelines.
- Able to work under tight and variable deadlines.
- Excellent interpersonal and communication skills.
- Strong networking, negotiation, and influencing skills.
- Adept at managing communication with assembly subcontractors.
How to Apply
If this aligns with your career aspirations and you want to join a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
Together, We Kandou It!
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