Join Our Team at Kandou
At Kandou, challenges fuel our passion and innovation defines our mission. We are a team of dedicated professionals making significant strides in the semiconductor industry, recognized as an innovative leader in high-speed, energy-efficient chip-to-chip link solutions. As we continue to evolve to meet today's consumer demands and prepare for tomorrow's advancements, we invite you to be a part of our dynamic, high-tech scale-up environment.
Responsibilities and Authority
- Complete all package design activities within the specified time frames as outlined by project deliverables.
- Conduct package design review processes with the assembly subcontractors to ensure adherence to design rules.
- Collaborate closely with the respective IC layout engineers during the package design phase.
- Verify the electrical characteristics of the package and unit design using available software tools.
- Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (including multi-layer, mechanical drill, and plating lines).
- Provide support, guidance, and instructions concerning assembly and package-related activities.
- Present detailed weekly reports on activities and progress to the cross-functional team.
- Engage with multi-functional groups, including product design, engineering, and marketing, to ensure that our package design and technology requirements are fully supported by Kandou’s assembly partners.
Required Competencies – Experience
- A minimum of 5 years of experience in IC package design using Cadence APD/SIP.
- Hands-on experience with Cadence tools (Virtuoso, Extract IM, Power DC) and Ansys software tools (SiWave, Q3D) or similar tools.
- Proficiency in AutoCAD.
- Strong knowledge of various electronic IC packaging technologies.
- Basic understanding of thermal and mechanical behavior of IC packages.
- Basic understanding of IC physical layout is beneficial.
Required Competencies – Skills
- Proven expertise in package design and RLC extraction.
- Ability to perform package parasitics extraction.
- Strong task management and planning capabilities, with proficiency in estimating timelines for design completion.
- Able to work to tight and fluctuating timelines.
- Excellent interpersonal and communication skills.
- Good networking, negotiation, and influencing capabilities.
- Adept at managing communication with assembly subcontractors.
Application Process
If this role aligns with your career aspirations and you wish to contribute to a growing company with a bright future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.
Together, We Kandou It!