Package Design Engineer / Package Design Engineeress

Join Our Team at Kandou

Challenges are our drive, and innovation is our calling. At Kandou, we pride ourselves on being a team of passionate and accomplished professionals making a mark in the semiconductor industry. As an innovative leader in high-speed and energy-efficient chip-chip link solutions, we are critical to the evolution of the electronics industry. We continuously develop to meet the demands of today's customers and those of tomorrow. If you thrive in a high-tech scale-up and are motivated by pushing your limits while challenging the status quo, we have an opportunity for you.

Responsibilities and Authority

• Complete all package design activities within the specified time frame as defined by project deliverables.
• Conduct package design review processes with assembly subcontractors to ensure compliance with design rules.
• Liaise closely with the respective IC layout engineers during the package design phase.
• Verify the electrical characteristics of the package and unit design using available software tools.
• Incorporate cost-effective methodologies into Kandou’s BGA substrate and LF designs (Multi-Layer / Mechanical Drill / Plating Lines, etc.).
• Provide support, guidance, and instructions regarding assembly/package-related activities, questions, and issues.
• Present detailed weekly reports of activities and progress to the cross-functional team.
• Collaborate with multi-functional groups, including product design, engineering, and marketing, to ensure our package design and technology requirements are fully supported by Kandou’s assembly partners.

Required Competencies – Experience

• Minimum of 5 years of experience in IC package design using Cadence APD / SIP.
• Hands-on experience using Cadence (Virtuoso / Extract IM / Power DC) and Ansys software tools (SiWave / Q3D) or similar tools.
• Experience using AutoCAD.
• Knowledge of various electronic IC packaging technologies is a must.
• Basic understanding of thermal and mechanical behavior of IC packages.
• Basic understanding of IC physical layout is beneficial.

Required Competencies – Skills

• Proven top-level package design and RLC extraction experience.
• Ability to perform package parasitics extraction.
• Strong task management and planning abilities, with proficiency in estimating timelines for design completion.
• Ability to work under tight and variable timelines.
• Strong interpersonal and communication skills.
• Good networking, negotiation, and influencing skills.
• Adept at managing communication with assembly subcontractors.

If this is the role you have been looking for and you want to be part of a growing company with an exciting future, we would love to hear from you. Apply online using the form below. Please note that only applications matching the job profile will be considered.

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